2015年9月14日星期一

OCA Vacuum Laminating Machine Fast Repair Mobile Screen

OCA Vacuum Laminating Machine Fast Repair Mobile Screen

Main features
MAG Vacuum laminating machine
MAG vacuum laminating machine, In addition to fit the global 7 inch LCD screen
Characteristics of equipment
No Modules Needed, No Debubbling Process Needed
Press to Boot, Easy Operation
Smart Constant Pressure; Automatic Shift to the Lamination and DebubblingMode
Connect the power supply can be used;
built-in vacuum pump and air compressor;

2015年8月27日星期四

The 21th NEPCON South China 2015.

The 21th NEPCON South China 2015.
Zhuomao has a successful close on the Exhibition.
We sincerely invite you to visit our factory !

















2015年8月21日星期五

Congratulations! Zhuomao European Agent bought 100 sets bga machines in August 2015.

Congratulations! Zhuomao European Agent bought 100 sets bga machines in August 2015. Thank you so much for your great support. Now the items are going to be shipped to the warehouse and ship by sea to European seaport.


2015年8月18日星期二

Good news ! sales promothion for bga rework station

Good news !
Now we are doing sales promotion for the 10th Anniversary ,promotion date is from 20th Aug to 20th Sep , you will get a 10% discount ,
and you will get free gifts .




2015年8月6日星期四

2015年7月17日星期五

EeIE 2015

Zhuomao sincerely invite you and your company representatives to attend-EeIE 2015.
China Electronic Equipment Industry Exhibition
Products: all SMT products.
Date: July 29~31, 2015  

2015年7月8日星期三

All about solder balls for BGA rework

Solder Balls, also called solder spheres, for BGA rework are miniature balls made from different types of solder alloys and are of various sizes. Most common sizes go from 0.20mm to 0.76mm.
List of common sizes used in most consumer electronics bga packages:
Solder balls 0.20mm
Solder balls 0.25mm
Solder balls 0.30mm
Solder balls 0.35mm
Solder balls 0.40mm
Solder balls 0.45mm
Solder balls 0.50mm
Solder balls 0.55mm
Solder balls 0.60mm
Solder balls 0.65mm
Solder balls 0.76mm
They come in Leaded and Lead Free alloys.
One of the most popular brands is PMTC (Profound Material Technology Corp.) from Taiwan.
For the average repair shop they're available in quantities of 25k and 250k containers.
Solder balls are sensitive to moisture and should be kept in a moisture fee environment. They're usually given a 1 year lifetime before their considered unreliable due to environmental exposure.
For the average repair shop, although not encouraged to do so, if the right ball size is not available we can use the next smaller size to perform a job.
When reballing a chip we need to use the corresponding preform (stencil) for the ball size.
We must make sure we close the solder balls container soon after we've finished using it to diminish moisture exposure.
Solderballs can be cleaned if they have become dirty by flux or any other foreign material. We just dump them in a bowl of alcohol or similar chemical and wash them off then let dry.
We must be aware that it is common to find some smaller (sometimes significantly smaller) solder balls within a given solder ball container. If during reballing a chip we see this we must remove this smaller ball and re-place with the right size. If we dont catch this while reballing and we solder the balls onto the chip, the chip will not have good contact, in comparison to the others, on that pad and will soon cause a cold solder joint.

2015年7月2日星期四

How BGA Rework Station Use to Rework the PCB

BGA rework station is the best reworking station for the printed circuit board (PCB) of the microprocessor of laptops, PCs, XBOX, and play station. Reworking is a word use for the resurfacing operation or repair of a printed circuit board (PCB) assembly, generally including desoldering of surface mounted electronic parts. Mass preparing procedures are not related to single device repair or replacement, and specific manual methods by master work force utilizing proper equipment are required to replace defective parts. Ball grid array (BGA) apparatuses especially require skill and suitable devices. A hot air gun or hot air station is required to hotness mechanisms and melt solders, and particular devices are utilized to get and position frequently small segments. A BGA Rework Station is a spot to do this work, the instruments and supplies for this work, regularly on a workbench. There is a certain reason for reworking of printed circuit board (PCB) and these reasons are the poor solder joints due to the reason of faulty components, and assembly or thermal cycling. Unnecessary drops of solder that connect all joints that should be isolated from each other. Engineering parts changes and upgrades etc.

The rework may include numerous segments, which must be chipped away at one by one without harm to encompassing parts or the PCB itself. All parts not being chipped away at are ensured from hotness and harm. Thermal stress on the electronic assembly is kept as low as would be prudent to anticipate unnecessary constrictions of the printed circuit board which may cause quick or future damage. Most soldering is carried out with lead-free solder, both on produced assemblies and in rework, to avoid the health and natural risks of lead. Where this precaution is not essential, tin lead solder dissolves at an easier temperature and is simpler to work with apportioned solder paste on the cushions of a QFPs. Cover and circles for reballing also by heating the single surface mount device with a hot air gun to melt all of the soldering joints in it and the printed circuit board mostly worked in starts followed by the removing of the surface mount device. The pad array on the conductor board should then be cleaned of previous solder and it is easier to remove these residues by heating them on a soldering iron or hot air gun can be used with desoldering braid. The exact situation of the new unit onto the ready cushion exhibit requires skilful utilization of an exceptionally correct vision arrangement system with high determination and amplification. The littler the pitch and size of the parts, the more exact working must be conducted. At the end new surface mount device is placed on the board. Dependable solder joints are encouraged by utilization of a solder profile which preheats the board, warms all the associations between the unit and the PCB to the liquefying temperature of the weld utilized, and then legitimately cools them.

This is how a BGA rework station do all these reworking and the reason to use BGA rework station is it prevent the printed circuit board from being overheating and which cause less damage in the reworking process.

High Automatic Rework System

Detailed Features
1 Large area of infrared carbon fiber Pre-heating system, with the advantage of pre-heating fast and evenly and no light pollution. 
2 Temperature parameters protected by limits of authority, for avoiding error settings.Repair
3 Ten segments of temperature control process, suitable for all kinds of  BGA Rework Station.
4 Unlimited storage of the temperature profile, just need press one key to use the profile.R
5 Three K-type sensors available can realize the high precise temperature testing of each point of PCB or BGA, and PC can generate report of curves analysis automatically. 
6 Desoldering and soldering automatically, No need the manual adjustment
7 BGA rework station ZM-R6000 Hot air flow can be adjustable to meet the demand of any chips
8 USB Connection driver-free, PC control
9 The bottom hot air lifting control available in the front panel, bga machine is convenient to adjust at any time. 

2015年6月25日星期四

LCD separator


This a 5 in 1 frame machine, which consist of heated, plate, A-frame separator, vacuum manual separator, glue remover and frame press, Right is the frame press switch, glue remover switch and thermostat, Left is the manual separator switch and thermostat, the first one on the right is the vacuum switch. The second one on the right is the A-frame switch. The left side is the A-frame switch. The Blade groove is used for putting the blade while operating glue removing. The three holes are used for fixing the blade. The Installed upper moulds are I phone 4, I phone 5, I phone 6(5.5) and the I phone 6(4.7).
    
When press the frame of I phone 6(4.7). Install directly, Lock it by the screws of front and back. We also have the lower moulds of Iphone6 (5.5), I phone 6(4.7), I phone 5s, I phone 4. Left mould is for the 5-6.6 inch middle frame, right mould is for the 4.5-5 inch middle frame.

l          Operation steps of Middle frame separation
1, Turn on the switch of heated plate thermostat on the left, then setting the temperature to 80.
2,A zip lock bag should be ready in advance, sprinkling the 503 cleaning agent on the assembly, put into the ziplock bag, zipping, then take it out after 5 minutes.

3, heating it on the heated plate about 20 seconds, turn on the corresponding mould switch, press the assembly on the suction mould. After being sucked, separating the middle frame slowly by hand.

l          Operation steps of glue remove
1, Loose the 3 screws of the blade groove, put in the blade and screws it.
2,Turn on the thermostat switch on the right side, setting the temperature to 180/
3, Put the sillca gel on the heated plate, after the temperature reached, put into the screen with the flex cable inby.
4, Push the screen, the height of the blade and screen should be the same, and then push the screen to remove the glue.

l          Operation steps of frame press
1, Turn on the thermostat switch on the right mould, setting the temperature to 160
2, Choose a lower mould need to press, put the lower mould into the plate(the groove of mould should be downwards), put the lower mould, align at the upper mould. Then fix the screws behind the lower mould.
3, After installing the frame of screen, put it into the lower mould with the right directing, then put the lower mould into the plate with the right position, push the lower mould, press the upper mould for 6-10 seconds. Take out of frame, frame press is finished.
4, When you press the I phone 6(4.7), it needs to install the iphone6(4.7) upper mould, while installing the upper mould, the home key should be downwards to buckle the upper mould, It can be used after fixing the 2 screws of front and back.

Points:
1, be careful of your hand. The temperature of the heated plate and upper mould are high.

2, Take off the blade while you needn’t remove the glue, to prevent from hurting in other operations.

2015年6月24日星期三

LED/ BGA rework station ZM-R720

Feature:
* Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired
* Suitable for LED lamp beads of tape packaging and bulk materials, also any BGA and components which are difficult to repair.
* High solution optical alignment system, accurate LED components positioning, ensure precise mounting.
* Optical alignment is controlled electrically, can rotate automatically
* Mounting head built-in pressure testing device, to protect the PCB
* Built-in infrared laser positioning, fast positioning for PCB.
* Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevent PCB to turn yellow.
* Bottom heater up and down manually, can adjust the heating height real time.
*Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serve life
* Human-machine interface has multiple operation mode and permission, welding, and mounting manually, easy operation.
* High resolution touch screen, which is up to 800*600 pixel
*Adopt joystick control for alignment system, no need setting complicated parameters
* Adopt Delta double ball bearing flow fan for air supplyno need external air source
* Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment

* Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC,which will close output channel and display fault condition. Protect itself automatically.

2015年6月17日星期三

BGA Rework Accessories

Rework accessories

This is a quick overview on the different accessories usually needed for doing printed circuit board rework, specifically BGA rework. It’ll give you an idea of what to get and when to get it so you don’t go spending more that you need to.





















BGA rework station:



Understanding Computer POST codes

Here some general information for using a POST card to troubleshoot laptop systems, although it also applies to desktop systems provided the right card configuration is used.

In laptop machines, the Mini Card PCI Express (PCI-E) replaces the Mini PCI card standard slot
design, which is a small internal card functionally identical to standard desktop computer PCI cards.
Mini Card PCI-E and Mini PCI cards are used mainly to add communications functions to portable
laptop computers that are built- or customized-to-order. The Mini Card PCI Express is half the size
of the Mini PCI cards. This allows system designers to include one or two cards, depending on the
size constraints of a particular portable computer. Our Diagnostic Card has BOTH SLOT TYPES
to allow for this technology transition.

A Diagnostic Card is a powerful diagnostic tool for technicians and administrators to
troubleshoot various problems of IBM compatible PCs.
With Diagnostic Cards in hand, you no longer have to go through tedious and time
consuming process of trying to figure out what is wrong with your PC hardware. The Diagnostic
Card will tell you exactly what is wrong with your PC in just seconds. It saves you time and
money.

Since new motherboards are always coming out, in order to keep up to date it's recommended
to visit the bios manufacturer's website, and download the
latest codes per bios revision. Or visit http://www.bioscentral.com for an online reference.

DUAL SLOT designs diagnostic cards are compatible with older Mini PCI slots as well as the new Mini Card ½ size
slot lead by Dell Computers. It is not necessary to install memory chips to perform analysis.
“POST Codes” can be displayed through the hexadecimal display panel on the Diagnostic Card
itself.

Follow the instructions of your particular POST card for intallation and recommended use.

It may be required the removal of a wireless card in expansion slot of motherboard
service port located on the bottom access door of most laptops.

-Install the Diagnostic Card in the Mini Card PCI-E slot or Mini PCI slot.
-Power on the machine.
-Observe POST CODE from bois.

POST Codes
When the machine is turned on, the hexadecimal display should show the various POST codes as
the system executes (unless it has a rare BIOS that does not display POST codes).
If the machine does not boot, system POST has detected a fatal fault and stopped. The number
showing in the hexadecimal display on the Diagnostic Card is the number of the test in which
POST failed.

Tips on using a diagnostic card

Sometimes your computer will not boot.Use the diagnostic card to see the POST (power on self test) codes that the BIOS commands the
motherboard to perform. Each motherboard has a BIOS chip which is a device that initializes all
hardware components on the motherboard such as CPU, memory, video card, etc. During the boot
up sequence, your BIOS will also generate what is called POST80 code. Each code can be
referenced in a manual supplied to help determine the problem with the motherboard. If your code
is NOT LISTED in your manual, chances are you have a newer motherboard. Visit the manufacturer
of your BIOS and download the manual of your BIOS direct. In most cases, where the last post
code is displayed on the POST card is generally the problem area. For example: If you have an
Award Bios on your motherboard, and you install this card. Turn on the power to your computer.
Your computer stops booting, but the POST card shows a code of “01 . This could mean you have
a faulty CPU on your motherboard because the BIOS told the CPU to start, but the CPU did not
respond. If a piece of hardware does not respond during a boot sequence, then the motherboard
will not finish POSTing.

2015年6月2日星期二

How to choose bga rework station

Hot Air is older and traditional, been around for about a decade. IR is relatively new in the reworking market.

Hot Air gives uneven heating. IR provides more even heat due to absorption rather than penetration thus a simple benefit of IR is it can remove plastic components, such as a CPU socket, with IR it penetrates the solder joints and does not burn or melt the plastic. IR is usually silent in operation because it has no air flow, while Hot Air uses a forced air system which is heated.

Technically speaking a Hot Air rework station is more complicated to manufacture than IR in structure and the cost is higher. This is because there are many cables in top hot air heater along with a fan system. Hot Air uses nozzles which is both a pro and a con, the con is you have to purchase different nozzles for different sizes of chips and the pro is that nozzles can be rotated in 360 degree which very easy for alignment.

IR stations tend to use ceramic heating plate, they give even heating without causing shift of other surrounding components due to the lack of air movement, but due to the IR plate being a fixed size, you may need to use high temperature tape to cover the surrounding area of the BGA chip. However when using Hot Air you may come across the same issue if your nozzle is not an exact fit or the air flow is too high.

Many of the expensive machines use Hot Air because well its been around longest and many companies do not want to switch. They have procedures in place and changing them will cost too much. Samsung or Intel with several millions of employees having to retrain and re certify them is too much. Why do you think so many companies still use Win 2K or XP, its all about the transition cost and time.

IR is newer, but it is gaining much more interest, the reason it has a bad name is due to the inferior plates being used. Higher end plates such as those fitted with Elstein heaters will perform much better.

Any person can perform reworking with just about anything. Anything from an open flame to a million dollar rework station. Heat guns, SMT stations, BGA stations, torches, stoves, ovens and more can all be used as heat sources. Understanding the heat source, using it properly and ensuring that its the right heat source for the job, is where many fail. Many rework technicians attribute their setup as being successful. Having success in regards to any amount for example 60% success rate or even 30% gives the user confidence in themselves and their process. 

Reworking is a science, its not just about heating things. Simplistically it can appear to be that is all we do, heat the chip and remove it. There are many variables involved. MSL moisture sensitivity level, package size and type, environmental variables, pcb thickness and quality, copper planes, flux, solderability and more.

Variables that affect User B may not be the same for User A thus having less success but longevity. The success rates can also change if the user does not update processes and monitor variables. The same principles can be applied to a chef, chef A is a veteran and has a dull knife, chef B is a noobie but has a very sharp knife. Chef A or B could have a better cut with their current setup, but if the 2 switched setups chef A would most always have the better cut while chef B would blame their setup for the lack of success.

Package temperature is also very important, non ROHS, PB, or lead packages would tolerate a temperature of around 235c, while ROHS, PB free, or lead free packages tolerate temperatures of around 260c. New processors and chipsets use integrated heat spreaders or IHS. It is a heatsink that is affixed semi permantely to the chip. When reworking an RSX chip with Hot Air the package would be much higher than the solder ball temp and this is due to the penetration technology heating up the RSX since it is closer to the heating source and was absorbing much of the heat, applying heat resistant tape to the IHS reduced the temperatures considerably. When reworking with IR the package temp was very close to the solder ball temp due to the absorbtion technology



2015年6月1日星期一

How to choose rework station BGA

BGA Rework Process Introduction 
1 Introduction 
Defects are caused by many reasons during soldering SMD components as empty soldering, short circuit and others, so repair is necessary. The rework process is simple for common SMD, resistor, capacitor, SOIC, SOJ, PLCC and others. With small alignment are more and more in electronic products, lots of BGA, CSP, QFP and others are more and more, so rework stations become good helpers for operators. 
2 How to Choose Rework Station 
Main differences of rework stations are heat source and heat mode; Take example only upper heat or upper and lower both heating, some can set temperature curve. Considering protecting components, the upper and lower both heating system are better. To prevent PCB warping during repairing, preheat function in the rework system is better. PCB fix, BGA position and others are important consideration. 
3 Rework process 
1) BGA disassemble 
Remove BGA chip with rework system and clean solder residue on PCB with solder iron to make solder pad flat; clean and remove flux residue with special cleaner. 
2) BGA dry
Please check all BGA chips dry or damp; put damp BGA components into dry box to dry. 
3) Print solder paste
Print solder paste on disassemble location before soldering BGA; small and special BGA stencil is necessary because there are other components on the board; Thickness and size of stencils are decided by BGA ball diameter and distance. 
For CSP whose ball diameter is <0.4mm, operators can cover flux on PCB solder pad directly. 
4) Mount BGA chips
Set rework program and put dry BGA into preparation location; rework system will take it automatically and then place it into soldering location. 
5) Solder 
Set soldering temperature according BGA size, PCB thickness and others; then rework station will complete soldering process. 
Take BGA rework station from Zhuomao as example. more details: www.seamarkzm.com 

Reworking a Component Using an Adhesive-Backed Stencil






Materials Needed:

New device to be placed
Solder paste
Isopropyl alcohol and lint free wipes for cleaning the stencil
Miniature squeegee
StickNPeel(TM) Stencil
Reflow source

Step 1: Clean the Site














After removing the original part, clean site with isopropyl alcohol and a lint free wipe to get rid of any contaminantst.

Step 2: Place the Stencil














Peel off the stencil from its adhesive backing and align the apertures in the stencil with the pads on the board. Starting at one corner, place the stencil and slowly work towards the opposite corner. Smooth down the stencil afterwards.

Step 3: Apply Solder Paste














After allowing the solder paste to come to room temperature, stir the paste and apply it to the stencil with a miniature squeegee. Hold the squeegee at a forty-five degree angle to the board and apply the paste using enough force to ensure that sufficient solder is compressed into the apertures. The nice thing is that if you need to go back and refill certain apertures you can do that with an adhesive-backed stencil.

Step 4: Remove the Stencil














Slowly peel off the stencil. Use a consistent speed to avoid smearing the solder paste.

Step 5: Inspect the Paste

Inspect the board to ensure that solder is distributed evenly on all of the pads. Make sure that none of the paste has been disturbed in peeling off the stencil.

Step 6: Place the Part














Gently place the part. Make sure to align the part properly and with the correct orientation.

Step 7: Reflow, Clean, and Inspect













Reflow the part. Afterwards, clean it with isopropyl alcohol and a lint free cloth. Inspect the part for any errors.