Reworking a Component Using an Adhesive-Backed Stencil

Materials Needed:

New device to be placed
Solder paste
Isopropyl alcohol and lint free wipes for cleaning the stencil
Miniature squeegee
StickNPeel(TM) Stencil
Reflow source

Step 1: Clean the Site

After removing the original part, clean site with isopropyl alcohol and a lint free wipe to get rid of any contaminantst.

Step 2: Place the Stencil

Peel off the stencil from its adhesive backing and align the apertures in the stencil with the pads on the board. Starting at one corner, place the stencil and slowly work towards the opposite corner. Smooth down the stencil afterwards.

Step 3: Apply Solder Paste

After allowing the solder paste to come to room temperature, stir the paste and apply it to the stencil with a miniature squeegee. Hold the squeegee at a forty-five degree angle to the board and apply the paste using enough force to ensure that sufficient solder is compressed into the apertures. The nice thing is that if you need to go back and refill certain apertures you can do that with an adhesive-backed stencil.

Step 4: Remove the Stencil

Slowly peel off the stencil. Use a consistent speed to avoid smearing the solder paste.

Step 5: Inspect the Paste

Inspect the board to ensure that solder is distributed evenly on all of the pads. Make sure that none of the paste has been disturbed in peeling off the stencil.

Step 6: Place the Part

Gently place the part. Make sure to align the part properly and with the correct orientation.

Step 7: Reflow, Clean, and Inspect

Reflow the part. Afterwards, clean it with isopropyl alcohol and a lint free cloth. Inspect the part for any errors.