BGA Reworking Full Professional Procedure

In order to perform proper BGA reworking you need the right tools and equipment for the job. Proper procedure and setup is crucial in order to achieve longevity in the repair.

Items needed:

BGA Rework Machine

Kingbo Flux

Kapton/ Aluminum Tape

Thermometer & Thermocouple


Step 1: Preparation
By prepping the board for rework you can eliminate the chances of:

Board flex

Popcorn

Delamination

Proper preparation is removing moisture from the board, many boards have a MSL or moisture sensitivity level. The safest way to remove moisture without having the proper data sheet is to bake the board at 80c for 24 hrs.

Ultrasonic cleaning can also be used to remove any contamination. Special cleaning solution is used which can restore a board to factory new condition.

Step 2: Support
A key ingredient in successful bga reworking is making sure the board is properly supported. If this step is skipped there is the risk that the board will bow or flex. Sometimes it is very obvious and other times it is hard to tell. A flexed board may contain damaged internal traces or lifted pads. This damage is not repairable.

You want to ensure that the board is stiff in all areas, so that when the board is heated it will not bend or move in any direction. The area around the chip being reworked should have extra support as it will reach extremely high temperatures and it is crucial that the board remains flat or solder bridges will occur causing shorts.

Many BGA rework machines include basic support systems. There are 3rd party board supports that can sometimes perform better than stock supports.